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AP2151WG-7 Datasheet(PDF) 5 Page - Diodes Incorporated |
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AP2151WG-7 Datasheet(HTML) 5 Page - Diodes Incorporated |
5 / 19 page AP2141/AP2151 0.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2141/AP2151 Rev. 6 5 of 19 JUNE 2009 DS31562 www.diodes.com © Diodes Incorporated Electrical Characteristics (TA = 25°C, VIN = +5.0V, unless otherwise stated) Symbol Parameter Test Conditions Min Typ. Max Unit VUVLO Input UVLO Rload=1kΩ 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT= 0 0.5 1 μA IQ Input Quiescent Current Enabled, IOUT= 0 45 70 μA ILEAK Input Leakage Current Disabled, OUT grounded 1 μA IREV Reverse Leakage Current Disabled, VIN= 0V, VOUT= 5V, IREV at VIN 1 μA RDS(ON) Switch on-resistance VIN = 5V, IOUT= 0.5A TA = 25°C SOT25, MSOP-8L-EP, SOP-8L 95 115 m Ω DFN2018-6 90 110 -40 °C ≤ T A ≤ 85°C 140 VIN = 3.3V, IOUT= 0.5A TA = 25°C 120 140 -40 °C ≤ T A ≤ 85°C 170 ISHORT Short-Circuit Current Limit Enabled into short circuit, CL=22μF 0.6 A ILIMIT Over-Load Current Limit VIN= 5V, VOUT= 4.8V, CL=22μF, -40°C ≤ TA ≤85°C 0.6 0.8 1.0 A ITrig Current limiting trigger threshold Output Current Slew rate (<100A/s) , CL=22μF 1.0 A VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V ISINK EN Input leakage VEN = 5V 1 μA TD(ON) Output turn-on delay time CL=1μF, Rload=10Ω 0.05 ms TR Output turn-on rise time CL=1μF, Rload=10Ω 0.6 1.5 ms TD(OFF) Output turn-off delay time CL=1μF, Rload=10Ω 0.01 ms TF Output turn-off fall time CL=1μF, Rload=10Ω 0.05 0.1 ms RFLG FLG output FET on-resistance IFLG =10mA 20 40 Ω TBlank FLG blanking time CIN=10uF, CL=22μF 4 7 15 ms TSHDN Thermal Shutdown Threshold Enabled, Rload=1kΩ 140 °C THYS Thermal Shutdown Hysteresis 25 °C θ JA Thermal Resistance Junction-to-Ambient SOP-8L (Note 4) 110 oC/W MSOP-8L-EP (Note 5) 60 oC/W SOT25 (Note 6) 157 oC/W DFN2018-6 (Note 7) 70 oC/W Notes: 4. Test condition for SOP-8L: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 5. Test condition for MSOP-8L-EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 6. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 7. Test condition for DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer 1.0”x1.4” ground plane. |
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