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PCA9555BS Datasheet(PDF) 31 Page - NXP Semiconductors |
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PCA9555BS Datasheet(HTML) 31 Page - NXP Semiconductors |
31 / 34 page PCA9555_8 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 08 — 22 October 2009 31 of 34 NXP Semiconductors PCA9555 16-bit I2C-bus and SMBus I/O port with interrupt 16.4 Package related soldering information [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. 17. Abbreviations Table 18. Suitability of through-hole mount IC packages for dipping and wave soldering Package Soldering method Dipping Wave CPGA, HCPGA - suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1] PMFP[2] - not suitable Table 19. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor GPIO General Purpose Input/Output I2C-bus Inter-Integrated Circuit bus SMBus System Management Bus I/O Input/Output ACPI Advanced Configuration and Power Interface LED Light Emitting Diode ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model CDM Charged Device Model PCB Printed-Circuit Board FET Field-Effect Transistor MSB Most Significant Bit LSB Least Significant Bit |
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