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MP6211 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP6211 Datasheet(HTML) 2 Page - Monolithic Power Systems |
2 / 11 page ![]() MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES MP6211_MP6212 Rev. 1.1 www.MonolithicPower.com 2 9/18/2009 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2009 MPS. All Rights Reserved. ORDERING INFORMATION Part Number * Enable Switch Maximum Continuous Load Current Typical Short- Circuit Current @ TA=25C Package Top Marking Temperature MP6211DN Active High Single 1.0A 1.5A SOIC8E MP6211DH Active High Single 1.0A 1.5A MSOP8E 6211D MP6212DN Active Low Single 1.0A 1.5A SOIC8E MP6212DH Active Low Single 1.0A 1.5A MSOP8E 6212D –40 °C to +85°C * For Tape & Reel, add suffix –Z (eg. MP6211_MP6212DN–Z). For RoHS Compliant Packaging, add suffix –LF. (eg. MP6211_MP6212DN–LF–Z) PACKAGE REFERENCE GND IN IN EN* NC OUT OUT FLAG 1 2 3 4 8 7 6 5 TOP VIEW EXPOSED PAD ON BACKSIDE MP6211_MP6212 Single-Channel (* EN is active high for MP6211) ABSOLUTE MAXIMUM RATINGS (1) IN .................................................-0.3V to +6.0V EN, FLAG, OUT to GND ..............-0.3V to +6.0V Continuous Power Dissipation. (TA = +25°C) (2) SOIC8E...................................................... 2.5W MSOP8E.................................................... 2.3W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature...............–65°C to +150°C Operating Temperature..............–40°C to +85°C Thermal Resistance (3) θJA θJC SOIC8E .................................. 50 ...... 10... °C/W MSOP8E................................. 55 ...... 12... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Measured on JESD51-7 4-layer PCB. |
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