TPD1052F

2012-01-20

4

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if

the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Thermal Resistance

Characteristics

Symbol

Rating

Unit

178.6(Note 1a)

Thermal resistance, channel to ambient

357.2(Note 1b)

°C / W

Note 1:

(a) Glass epoxy board

(b) Glass epoxy board

Characteristics

Symbol

Rating

Unit

Drain-source voltage

40

V

DC

-0.3 to 25

V

Supply voltage

Pulse

40 (t ≤ 200ms)

V

Input voltage

−0.3 to 6

V

Diagnosis output voltage

−0.3 to 6

V

Output current

Internally limited

A

Diagnosis output current

5

mA

Power dissipation (Note 1a)

0.7

Ｗ

Power dissipation (Note 1b)

0.35

Ｗ

Operating temperature

−40 to 125

°C

Channel temperature

150

°C

Storage temperature

−55 to 150

°C

Glass epoxy board

Material：FR-4

25.4mm×25.4mm×0.8mm

Glass epoxy board

Material：FR-4

25.4mm×25.4mm×0.8mm