Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

Product Dimensions

DIMENSIONS:

MM

(INCHES)

Model

AB

C

D

E

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Min.

Max.

MF-USML175

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-USML190

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-USML200

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-USML230

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-USML250

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-USML270

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-USML300

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-USML350

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-USML380

3.00

(0.118)

3.43

(0.135)

2.35

(0.093)

2.80

(0.110)

0.30

(0.012)

0.60

(0.024)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

Packaging: 3000 pcs. per reel.

Terminal material:

ENIG-plated terminals

(Tin-plated terminals available upon

request).

Termination pad solderability:

Meets ANSI/J-STD-002 Category 2.

Recommended Storage:

40 °C max./70 % RH max.

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Solder Reflow Recommendations

Notes:

•

MF-USML models cannot be wave soldered or hand soldered. Please

contact Bourns for soldering recommendations.

•

If reflow temperatures exceed the recommended profile, devices may

not meet the performance requirements.

•

Compatible with Pb and Pb-free solder reflow profiles.

•

Excess solder may cause a short circuit, especially during hand

Recommendation guidelines.

•

Designed for single solder reflow operations.

Recommended Pad Layout

2.5 ± 0.1

(.098 ± .004)

2.0 ± 0.1

(.079 ± .004)

1.0 ± 0.05

(.039 ± .002)

1.0 ± 0.05

(.039 ± .002)

Bottom View

D

E

A

B

C

Top View

Side View