PACKAGE MECHANICAL INFORMATION

8-SOIC

1

Specifications are subject to change without notice.

MAY 2004 — REVISED JANUARY 2006

Customers should verify actual device performance in their specific applications.

Package Outline Dimensions

NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.

B. Body dimensions do not include mold flash or protrusion.

C. Mold flash or protrusion shall not exceed 0.15 (0.006).

D. Lead tips to be planar within ±0.051 (0.002).

MD-8SOIC-001-b

5.80 - 6.20

(0.228 - 0.244)

4.80 - 5.00

(0.189 - 0.197)

8

7

6

5

4

3

2

1

3.81 - 4.00

(0.150 - 0.157)

7° NOM

3 Places

7° NOM

4 Places

4° ±4°

0.28 - 0.79

(0.011 - 0.031)

0.102 - 0.203

(0.004 - 0.008)

x 45° NOM

0.190 - 0.229

(0.0075 - 0.0090)

INDEX

Pin Spacing

1.27

(0.050)

(see Note A)

6 Places

1.35 - 1.75

(0.053 - 0.069)

0.36 - 0.51

(0.014 - 0.020)

8 Places

0.51 - 1.12

(0.020 - 0.044)

0.25 - 0.50

(0.010 - 0.020)

4.60 - 5.21

(0.181 - 0.205)

MS-012AA, JEDEC Publication 95

DIMENSIONS ARE :

MILLIMETERS

(INCHES)

8-Pin Plastic Small Outline Surface Mount