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8-SOIC Datasheet(PDF) 1 Page - Bourns Electronic Solutions |
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8-SOIC Datasheet(HTML) 1 Page - Bourns Electronic Solutions |
1 / 4 page PACKAGE MECHANICAL INFORMATION 8-SOIC 1 Specifications are subject to change without notice. MAY 2004 — REVISED JANUARY 2006 Customers should verify actual device performance in their specific applications. Package Outline Dimensions NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition. B. Body dimensions do not include mold flash or protrusion. C. Mold flash or protrusion shall not exceed 0.15 (0.006). D. Lead tips to be planar within ±0.051 (0.002). MD-8SOIC-001-b 5.80 - 6.20 (0.228 - 0.244) 4.80 - 5.00 (0.189 - 0.197) 8 7 6 5 4 3 2 1 3.81 - 4.00 (0.150 - 0.157) 7° NOM 3 Places 7° NOM 4 Places 4° ±4° 0.28 - 0.79 (0.011 - 0.031) 0.102 - 0.203 (0.004 - 0.008) x 45° NOM 0.190 - 0.229 (0.0075 - 0.0090) INDEX Pin Spacing 1.27 (0.050) (see Note A) 6 Places 1.35 - 1.75 (0.053 - 0.069) 0.36 - 0.51 (0.014 - 0.020) 8 Places 0.51 - 1.12 (0.020 - 0.044) 0.25 - 0.50 (0.010 - 0.020) 4.60 - 5.21 (0.181 - 0.205) MS-012AA, JEDEC Publication 95 DIMENSIONS ARE : MILLIMETERS (INCHES) 8-Pin Plastic Small Outline Surface Mount |
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