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MP62071 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP62071 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 11 page  MP62071 –SINGLE CHANNEL 0.8A CURRENT-LIMITED POWER DISTRIBUTION SWITCH MP62071 Rev. 0.9 www.MonolithicPower.com 2 9/18/2009 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2009 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Enable Switch Maximum Continuous Load Current Typical Short- Circuit Current @ TA=25C Package Temperature MP62071DH Active High Single 0.8A 1.25A MSOP8E –40 °C to +85°C MP62071DN Active High Single 0.8A 1.25A SOIC8E –40 °C to +85°C For Tape & Reel, add suffix –Z (eg. MP62071DN–Z); For RoHS Compliant Packaging, add suffix –LF(eg. MP62071DN–LF–Z) PACKAGE REFERENCE 1 2 3 4 8 7 6 5 TOP VIEW GND IN IN EN OUT OUT OUT FLAG EXPOSED PAD ON BACKSIDE CONNECT TO GND GND IN IN EN OUT OUT OUT FLAG 1 2 3 4 8 7 6 5 TOP VIEW EXPOSED PAD ON BACKSIDE CONNECT TO GND MSOP8E SOIC8E MP62071 Single-Channel ABSOLUTE MAXIMUM RATINGS (1) IN ....................................................-0.3V to +6V ON, FLAG, OUT to GND.................-0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) MSOP8E.................................................... 2.3W SOIC8E...................................................... 2.5W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature...............–65°C to +150°C Operating Temperature..............–40°C to +85°C Thermal Resistance (3) θJA θJC MSOP8E................................. 55 ...... 12... °C/W SOIC8E .................................. 50 ...... 10... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Measured on JESD51-7, 4-layer PCB.. |
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