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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society

MATERIAL DECLARATION SHEET

No.

Construction

Element(subpart)

Homogeneous

Material

Material

weight

[mg]

Homogeneous

Material\

Substances

CASRN

if applicable

Materials

Mass %

Material

Mass % of

total unit wt.

Subpart

mass of total

wt. (%)

1

Semiconductor

Device

Silicon Chip

7.84

Doped silicon

7440-21-3

100

5.53

5.53

Copper

7440-50-8

95.645

41.61

Iron

7439-89-6

2.185

0.95

Tin

7440-31-5

0.034

0.01

Zinc

7440-66-6

0.135

0.06

2

Lead Frame

Copper alloy with

silver plating

61.68

Silver (plating)

7440-22-4

2.0

0.87

43.5

3

Bond wire

Gold wire

0.26

Gold

7440-57-5

100

0.18

0.18

Di-ester resin

proprietary

3

0.055

Functionalized ester

proprietary

7

0.13

3

0.055

4

Die Attach

Adhesive

2.56

Silver

7440-22-4

87

1.57

1.81

Silica fused

60676-86-0

90.5

41.27

Epoxy resin

proprietary

4.7

2.14

Phenolic resin

proprietary

4.7

2.14

5

Mold compound

(halogen-free)

Epoxy resin

64.66

Carbon black

1333-86-4

0.1

0.05

45.6

6

Matte tin plating

matte tin

4.79

Tin

7440-31-5

100

3.38

3.38

Total weight 141.79

This Document was updated on:

January 12, 2010

Important remarks:

1. It is the responsibility of the user to verify they are accessing the latest version.

Material Number

P850-U180-WH

Product Line

TBU

Compliance Date

January-2008

RoHS Compliant

Yes

MSL

3