Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Product Dimensions

DIMENSIONS:

MM

(INCHES)

Recommended Pad Layout

finish. For improved thermal dissipation, the recommended layout

uses PCB copper areas which extend beyond the exposed solder

pad. The exposed solder pads should be defined by a solder mask

ing. It is recommended that they should be the same dimension as

0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.

to ensure adequate clearance is maintained. The recommended

stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil

opening size 0.025 mm (0.0010 in.) less than the solder pad size.

Extended copper areas beyond the solder pad significantly improve

the junction to ambient thermal resistance, resulting in operation

at lower junction temperatures with a corresponding benefit of reli-

ability. All pads should soldered to the PCB, including pads marked

as NC or NU but no electrical connection should be made to these

pads. For minimum parasitic capacitance, it is recommended that

signal, ground or power signals are not routed beneath any pad.

PIN 1 & BACKSIDE CHAMFER

4.00 ± 0.10

(.157 ± .004)

0.00 - 0.05

(.000 - .002)

6.50 ± 0.10

(.256 ± .004)

0.85 ± 0.05

(.033 ± .002)

0.30

(.012)

3.40

(.134)

0.30

(.012)

1.85

(.073)

0.70

(.028)

0.70

(.028)

0.80

(.031)

1.85

(.073)

C

PIN 1

0.25

(.010)

3

2

1

Pad #

Pin Out

1

Line In/Out

2NU

3

Line Out/In

Pad Designation

Dark grey areas show added PCB copper area for better

thermal resistance.