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AM29F200AT-90DGI Datasheet(PDF) 7 Page - Advanced Micro Devices |
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AM29F200AT-90DGI Datasheet(HTML) 7 Page - Advanced Micro Devices |
7 / 8 page 1/13/98 Am29F200A Known Good Die 7 SUP P LEM E NT PHYSICAL SPECIFICATIONS Die dimensions . . . . . . . . . . . . . . 191 mils x 174 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.85 mm x 4.42 mm Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils Bond Pad Size . . . . . . . . . . . . . . 4.55 mils x 4.55 mils . . . . . . . . . . . . . . . . . . . . . . . . . . 115.6 µm x 115.6 µm Pad Area Free of Passivation . . . . . . . . . .20.70 mils2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,363 µm2 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal, may be grounded (optional) Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride DC OPERATING CONDITIONS VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V Junction Temperature Under Bias . .TJ (max) = 130°C Operating Temperature Commercial . . . . . . . . . . . . . . . . . . . 0 °C to +70°C Industrial . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Extended . . . . . . . . . . . . . . . . . . –55 °C to +125°C MANUFACTURING INFORMATION Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC Manufacturing ID (Top Boot) . . . . . . . . . . . . 98483AK (Bottom Boot) . . . . . . . .98483ABK Preparation for Shipment . . . . . . . . Penang, Malaysia Fabrication Process . . . . . . . . . . . . . . . . . . . CS29AF Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SPECIAL HANDLING INSTRUCTIONS Processing Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250 °C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Storage Store at a maximum temperature of 30 °C in a nitrogen- purged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. |
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