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W25Q64FVSSIQ Datasheet(PDF) 9 Page - Winbond |
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W25Q64FVSSIQ Datasheet(HTML) 9 Page - Winbond |
9 / 89 page W25Q64FV Publication Release Date: October 07, 2013 - 9 - Revision L 3.7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) D1 /HOLD(IO3) DI(IO0) DO(IO1) /WP (IO2) D2 D3 D4 NC E1 NC NC NC E2 E3 E4 NC F1 NC NC NC F2 F3 F4 NC A1 NC NC NC A2 A3 A4 NC B1 VCC GND CLK B2 B3 B4 NC C1 NC /CS C2 C3 C4 NC Top View Package Code TC D1 /HOLD(IO3) DI(IO0) DO(IO1) /WP (IO2) D2 D3 D4 NC E1 NC NC NC E2 E3 E4 NC B5 NC NC NC A2 A3 A4 NC B1 VCC GND CLK B2 B3 B4 NC C1 NC /CS C2 C3 C4 NC Top View Package Code TB C5 NC D5 NC E5 NC A5 NC Figure 1e. W25Q64FV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB / TC) 3.8 Ball Description TFBGA 8x6-mm BALL NO. PIN NAME I/O FUNCTION B2 CLK I Serial Clock Input B3 GND Ground B4 VCC Power Supply C2 /CS I Chip Select Input C4 /WP (IO2) I/O Write Protect Input (Data Input Output 2)* 2 D2 DO (IO1) I/O Data Output (Data Input Output 1)* 1 D3 DI (IO0) I/O Data Input (Data Input Output 0)* 1 D4 /HOLD (IO3) I/O Hold Input (Data Input Output 3)* 2 Multiple NC No Connect *1 IO0 and IO1 are used for Standard and Dual SPI instructions *2 IO0 – IO3 are used for Quad SPI instructions |
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