W25X40CLSSIG datasheet(3/53 Pages) WINBOND

Part #	W25X40CLSSIG

Description	2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

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Manufacturer	WINBOND [Winbond]

Direct Link	http://www.winbond.com

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W25X40CL

Publication Release Date: October 15, 2012

- 3 -

Revision E

8.2.16

32KB Block Erase (52h) ...............................................................................................27

8.2.17

Block Erase (D8h) ........................................................................................................28

8.2.18

Chip Erase (C7h or 60h)...............................................................................................29

8.2.19

Power-down (B9h)........................................................................................................30

8.2.20

Release Power-down / Device ID (ABh).......................................................................31

8.2.21

Read Manufacturer / Device ID (90h) ...........................................................................33

8.2.22

Read Manufacturer / Device ID Dual I/O (92h) .............................................................34

8.2.23

Read Unique ID Number (4Bh) ....................................................................................35

8.2.24

JEDEC ID (9Fh)............................................................................................................36

9.

ELECTRICAL CHARACTERISTICS......................................................................................... 37

9.1

Absolute Maximum Rating............................................................................................ 37

9.2

Operating Ranges......................................................................................................... 37

9.3

Power-up Timing and Write Inhibit Threshold .............................................................. 38

9.4

DC Electrical Characteristics ........................................................................................ 39

9.5

AC Measurement Conditions........................................................................................ 40

9.6

AC Electrical Characteristics ........................................................................................ 41

AC Electrical Cha

racteristics (cont’d)........................................................................................ 42

9.7

Serial Output Timing ..................................................................................................... 43

9.8

Serial Input Timing ........................................................................................................ 43

9.9

HOLD Timing ................................................................................................................ 43

9.10

WP Timing .................................................................................................................... 43

10.

PACKAGE SPECIFICATION .................................................................................................... 44

10.1

8-Pin SOIC 150-mil (Package Code SN)...................................................................... 44

10.2

8-Pin VSOP8 150-mil (Package Code SV)................................................................... 45

10.3

8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 46

10.4

8-Pad 6x5mm WSON (Package Code ZP) .................................................................. 47

10.5

8-

Pad WSON 6x5mm Cont’d........................................................................................ 48

10.6

8-Pad USON 2x3-mm (Package Code UX).................................................................. 49

10.7

8-pin PDIP 300-mil (Package Code DA) ...................................................................... 50

11.

ORDERING INFORMATION..................................................................................................... 51

11.1

Valid Part Numbers and Top Side Marking .................................................................. 52

12.

REVISION HISTORY ................................................................................................................ 53

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