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STPS15M80CT Datasheet(PDF) 5 Page - STMicroelectronics |
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STPS15M80CT Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 11 page STPS15M80C Characteristics Doc ID 018723 Rev 1 5/11 Figure 14. Thermal resistance junction to ambient versus copper surface under tab for D2PAK Figure 12. Forward voltage drop versus forward current (per diode) Figure 13. Reverse safe operating area (tp < 1 µs and Tj < 150 °C) 0.0 2.5 5.0 7.5 10.0 12.5 15.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 (Typical values) T = 125 °C j (Maximum values) T = 125 °C j (Maximum values) T = 25 °C j I (A) FM V (V) FM I (A) arm 10.0 11.0 12.0 13.0 14.0 15.0 16.0 100 105 110 115 120 125 130 135 140 145 150 I (V ) 150 °C, 1 µs arm arm V (V) arm 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 DPAK 2 R (°C/W) th(j-a) S (cm ) Cu 2 epoxy printed board copper thickness = 35 µm |
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