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MM5Z27VT1G Datasheet(PDF) 1 Page - ON Semiconductor |
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MM5Z27VT1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 4 page © Semiconductor Components Industries, LLC, 2013 April, 2013 − Rev. 10 1 Publication Order Number: MM5Z2V4T1/D MM5ZxxxT1G Series, SZMM5ZxxxT1G Series Zener Voltage Regulators 300 mW SOD−523 Surface Mount This series of Zener diodes is packaged in a SOD−523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. Specification Features: • Standard Zener Breakdown Voltage Range − 2.4 V to 75 V • Steady State Power Rating of 300 mW • Small Body Outline Dimensions: 0.047 ″ x 0.032″ (1.20 mm x 0.80 mm) • Low Body Height: 0.028″ (0.7 mm) • ESD Rating of Class 3 (> 16 kV) per Human Body Model • AEC−Q101 Qualified and PPAP Capable − SZMM5ZxxxT1G • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements • These are Pb−Free Devices* Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260 °C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Max Unit Total Device Dissipation FR−5 Board, @ TA = 25°C PD 300 mW Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 390 °C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method (25 mm2, 2 oz., 3.8 mm plating). *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Device Package Shipping† ORDERING INFORMATION 1 Cathode 2 Anode See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 3 of this data sheet. DEVICE MARKING INFORMATION http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. SOD−523 CASE 502 STYLE 1 MARKING DIAGRAM 1 2 MM5ZxxxxT1G SOD−523 (Pb−Free) 3,000 / Tape & Reel XX = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. XX M G G SZMM5ZxxxT1G SOD−523 (Pb−Free) 3,000 / Tape & Reel |
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