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LM3670MF-ADJ Datasheet(PDF) 4 Page - Texas Instruments |
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LM3670MF-ADJ Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page LM3670 SNVS250E – NOVEMBER 2004 – REVISED FEBRUARY 2013 www.ti.com Absolute Maximum Ratings (1) (2) VIN Pin: Voltage to GND −0.2V to 6.0V EN Pin: Voltage to GND −0.2V to 6.0V FB, SW Pin: (GND −0.2V) to (VIN + 0.2V) Junction Temperature (TJ-MAX) −45°C to +125°C Storage Temperature Range −45°C to +150°C Maximum Lead Temperature (Soldering, 10 sec.) 260°C ESD Rating (3) Human Body Model: VIN, SW, FB, EN, GND 2.0kV Machine Model: 200V (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (3) The Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 Operating Ratings (1) (2) Input Voltage Range 2.5V to 5.5V Recommended Load Current 0A to 350 mA Junction Temperature (TJ) Range −40°C to +125°C Ambient Temperature (TA) Range −40°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. Thermal Properties Juntion-to-Ambient Thermal Resistance ( θJA) (1) 250°C/W (1) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. 4 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LM3670 |
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