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MATERIAL DECLARATION SHEET

Copper

7440-50-8

88.9

10.177

Iron

7439-89-6

0.5

0.057

Tin

7440-31-5

10

1.145

Graphite

7440-66-6

0.1

0.011

4

Bearing

Bronze

1.741

Other

----

0.5

0.057

11.45

PCB-Copper

0.021

Copper

7440-50-8

100

2.728

Glass fiber

65997-17-3

55

1.500

PCB-Laminate

0.383

Phenol

26265-08-7

45

1.227

Bisphenol A, epichlorohydrin polymer

25068-38-6

56.9

1.552

Talc

14807-96-6

2

0.055

Barium Sulfate

7727-43-7

13.1

0.357

Tri-2, 1-ethanediyl triacrylate

40220-08-4

2.8

0.076

Quartz

14808-60-7

20

0.546

Hexabromo-decachloro-phthalocyaninato

14302-13-7

0.4

0.011

Cyanoguanidine

461-58-5

0.1

0.003

Solder Resist

0.01

Further Additives

----

4.7

0.128

Gold

7440-57-5

3.8

0.104

5

PCB Panel

PCB-Metals

0.00083

Nickel

7440-02-0

96.2

2.624

2.73

Barium

7440-39-3

48.5

0.057

Oxygen

7782-44-7

20.2

0.024

Titanium

7440-32-6

16.8

0.020

Nickel

7440-02-0

13.7

0.016

Ceramic Body

0.0053

Misc, not to declare

----

0.8

0.001

Copper

7440-50-8

47

0.055

Nickel

7440-02-0

12.1

0.014

Tin

7440-31-5

37.4

0.044

6

Capacitors X

3

Soldering

Termination

0.00068

Misc, not to declare

----

3.5

0.004

0.12