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TPS79301DBVRG4 Datasheet(PDF) 8 Page - Texas Instruments |
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TPS79301DBVRG4 Datasheet(HTML) 8 Page - Texas Instruments |
8 / 20 page www.ti.com APPLICATION INFORMATION TPS793xx GND EN NR IN OUT V IN V OUT 0.1 µF 0.01 µF 2.2 µF V IN V OUT External Capacitor Requirements Board Layout Recommendation to Improve PSRR and Noise Performance TPS793xx SLVS348K – JULY 2001 – REVISED OCTOBER 2007 The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output noise, low quiescent current (170 μA typically), and enable-input to reduce supply currents to less than 1μA when the regulator is turned off. A typical application circuit is shown in Figure 22. Figure 22. Typical Application Circuit A 0.1 μF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the TPS793xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated or the device is located several inches from the power source. Like most low-dropout regulators, the TPS793xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitance is 2.2 μF. Any 2.2μF or larger ceramic capacitor is suitable, provided the capacitance does not vary significantly over temperature. If load current is not expected to exceed 100mA, a 1.0 μF ceramic capacitor can be used. The internal voltage reference is a key source of noise in an LDO regulator. The TPS793xx has an NR pin which is connected to the voltage reference through a 250k Ω internal resistor. The 250kΩ internal resistor, in conjunction with an external bypass capacitor connected to the NR pin, creates a low-pass filter to reduce the voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate properly, the current flow out of the NR pin must be at a minimum, because any leakage current creates an IR drop across the internal resistor, thus creating an output error. Therefore, the bypass capacitor must have minimal leakage current. The bypass capacitor should be no more than 0.1 μF to ensure that it is fully charged during the quickstart time provided by the internal switch shown in the Functional Block Diagrams. As an example, the TPS79328 exhibits only 32 μVRMS of output voltage noise using a 0.1μF ceramic bypass capacitor and a 2.2 μF ceramic output capacitor. Note that the output starts up slower as the bypass capacitance increases due to the RC time constant at the NR pin that is created by the internal 250k Ω resistor and external capacitor. To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND pin of the device. 8 Submit Documentation Feedback Copyright © 2001–2007, Texas Instruments Incorporated |
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