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ADNS-8020 Datasheet(PDF) 6 Page - Pixart Imaging Inc. |
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ADNS-8020 Datasheet(HTML) 6 Page - Pixart Imaging Inc. |
6 / 38 page 6 Assembly Recommendations 1. Insert the sensor package and all other electrical components into the application PCB. 2. Wave-solder the entire assembly in a no-wash soldering process utilizing a solder fixture. The solder fixture is needed to protect the sensor during the solder process. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact. NOTE: Sensor package does not support IR reflow soldering process. 3. Place the lens onto the base plate. Care must be taken to avoid contamination on the optical surfaces. 4. Remove the protective kapton tapes from the optical aperture of the sensor and VCSEL respectively. Care must be taken to keep contaminants from entering the aperture. 5. Insert the PCB assembly over the lens onto the base plate. The sensor package should self-align to the lens. The optical position reference for the PCB is set by the base plate and lens. The alignment guide post of the lens locks the lens and sensor package together. Note that the PCB motion due to button presses must be minimized to maintain optical alignment. 6. Optional: The lens can be permanently locked to the sensor package by melting the lens’ guide posts over the sensor with heat staking process. Press down with a force value of between 500gf - 1kgf to ensure good mating between lens and sensor package. The gap between the lens and sensor after heat stake process must be less than 80 micron. 7. Install the mouse top case. There must be a feature in the top case (or other area) to press down onto the sensor to ensure the sensor and lenses are interlocked to the correct vertical height. 8. Susceptibility of VCSEL to Delamination Failure. The moisture sensitive component VCSEL device is not handled in accordance with the MSL 3 requirements an increased chance of VCSEL failure is present. Design Considerations for Improving ESD Performance For improved electrostatic discharge performance, typical creepage and clearance distance are shown in the table below. Assumption: base plate construction as per the PixArt supplied 3D model file when use with the lens. The lens can be sealed (i.e. glued) to the base plate. Note that the lens material is polycarbonate and therefore, cyanoac- rylate based adhesives or other adhesives that may dam- age the lens should NOT be used. Typical Distance In millimeters (mm) Creepage 7.12 Clearance 3.80 Figure 5. Block diagram of sensor Sensor NCS SCLK MOTION MOSI MISO LASER_NEN XY_LASER -VCSEL AGND VDD3 VDD3 VDD1.8 VDDIO DGND +VCSEL Image Oscillator LASER Drive VCSEL Regulatory Requirements Passes FCC B and worldwide analogous emission limits when assembled into a mouse and following PixArt recommendations. Passes IEC-1000-4-3 radiated susceptibility level when assembled into a mouse following PixArt recommendations. Passes IEC-61000-4-2 Electrostatic Discharge Immunity Test (ESD) and provides sufficient ESD creepage/ clearance distance to withstand discharge up to 15kV when assembled into a mouse according to usage instructions above. Passes IEC/EN 60825-1 Eye Safety Class 1 when operating with the laser output power pre-calibrated by PixArt Imaging without external hardware and software control of laser current. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. PixArt Imaging Inc. E-mail: fae_service@pixart.com.tw |
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