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ADP1706ACPZ-1.5-R7 Datasheet(PDF) 5 Page - Analog Devices |
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ADP1706ACPZ-1.5-R7 Datasheet(HTML) 5 Page - Analog Devices |
5 / 20 page ADP1706/ADP1707/ADP1708 Rev. 0 | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating IN to GND −0.3 V to +6 V OUT to GND –0.3 V to IN EN to GND –0.3 V to +6 V SS/ADJ/TRK to GND –0.3 V to +6 V SENSE to GND –0.3 V to +6 V Storage Temperature Range –65°C to +150°C Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type θJA Unit 8-Lead SOIC (Exposed Paddle) 58 °C/W 8-Lead 3 mm × 3 mm LFCSP (Exposed Paddle) 66 °C/W ESD CAUTION |
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