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AS1312 Datasheet(PDF) 3 Page - ams AG

Part # AS1312
Description  Ul t ra Low Quiescent Cur rent , Hysteret ic DC-DC Step-Up Conver ter
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Manufacturer  AMSCO [ams AG]
Direct Link  http://www.ams.com
Logo AMSCO - ams AG

AS1312 Datasheet(HTML) 3 Page - ams AG

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Revision 1.12
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AS1312
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
VIN, VOUT, EN, LBI, LBO to GND
-0.3
+7
V
LX, REF to GND
-0.3
VOUT + 0.3
V
Input Current (latch-up immunity)
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM
±2
kV
Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Thermal Resistance
θJA
TDFN
60
ºC/W
Junction-to-ambient thermal resistance is very
dependent on application and board-layout. In
situations where high maximum power dissipation
exists, special attention must be paid to thermal
dissipation during board design.
WL-CSP
97
Junction Temperature
+125
ºC
Storage Temperature Range
-55
+150
ºC
for 8-pin (2x2) TDFN
-55
+125
ºC
for 8-pin WL-CSP
Package Body Temperature
+260
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte
tin (100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitive Level
1
Represents a maximum floor life time of unlimited


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