Ver 201208

CI

M10U121NC

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(1) Chip Beads

(2) M: Multi-layer type B:Mono-layer type

(3) Dimension

(4) Material Code

(5) Nominal impedance (121:120

Ω, 202:2000Ω )

(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)

(7) Packaging(C:paper tape, E:embossed tape)

PACKAGING

Packaging Style

Quantity(pcs/reel)

Card Board Taping

4000

RECOMMENDED SOLDERING CONDITION

PRODUCT IDENTIFICATION

REFLOW SOLDERING

FLOW SOLDERING

■ NOTICE :All specifications are subject to change without previous notice. Please contact with

product representatives or engineers to check specifications.