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AD8183 Datasheet(PDF) 3 Page - Analog Devices

Part # AD8183
Description  380 MHz, 25 mA, Triple 2:1 Multiplexers
Download  16 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD8183 Datasheet(HTML) 3 Page - Analog Devices

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REV. 0
AD8183/AD8185
–3–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0 V
DVCC to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 0.2 V
Internal Power Dissipation
2, 3
AD8183/AD8185 24-Lead TSSOP (RU) . . . . . . . . . . . . . 1 W
Input Voltage
IN0A, IN0B, IN1A, IN1B, IN2A, IN2B . . . . . VEE ≤ VIN ≤ VCC
SELECT
A/B, OE . . . . . . . . . . . . . . . . . . DGND
≤ V
IN ≤ VCC
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . Indefinite
3
Storage Temperature Range . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air (T
A = 25°C).
324-lead plastic TSSOP;
θ
JA = 128°C/W. Maximum internal power dissipation (P D)
should be derated for ambient temperature (TA) such that PD < (150°C–TA)/θJA.
ORDERING GUIDE
Temperature
Package
Package
Model
Range
Description
Option
AD8183ARU
–40
°C to +85°C 24-Lead Plastic TSSOP RU-24
AD8185ARU
–40
°C to +85°C 24-Lead Plastic TSSOP RU-24
AD8183-EVAL
Evaluation Board
AD8185-EVAL
Evaluation Board
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8183/
AD8185 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150
°C. Temporarily exceeding this
limit may cause a shift in parametric performance due to a
change in the stresses exerted on the die by the package. Exceeding
a junction temperature of 175
°C for an extended period can
result in device failure.
While the AD8183/AD8185 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150
°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 2.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8183/AD8185 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
AMBIENT TEMPERATURE – C
2.0
–50 –40 –30 –20 –10
0
10 20
30
40 50
60 70
80
90
1.5
1.0
0
TJ = 150 C
0.5
Figure 2. Maximum Power Dissipation vs. Temperature
PIN CONFIGURATION
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
AD8183/
AD8185
IN0A
VCC
DGND
OE
IN1A
SEL
A/B
GND
VCC
IN2A
OUT0
VCC
VEE
VEE
OUT1
IN2B
VCC
GND
OUT2
IN1B
VEE
GND
DVCC
IN0B
VCC


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