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LT1129MPST-3.3 Datasheet(PDF) 10 Page - Linear Technology |
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LT1129MPST-3.3 Datasheet(HTML) 10 Page - Linear Technology |
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10 / 16 page  LT1129/LT1129-3.3/LT1129-5 10 112935ff APPLICATIONS INFORMATION Thermal Considerations The power handling capability of the device will be limited by the maximum rated junction temperature (125°C). The power dissipated by the device will be made up of two components: 1. Output current multiplied by the input/output voltage differential: IOUT • (VIN – VOUT), and 2. Ground pin current multiplied by the input voltage: IGND • VIN. The ground pin current can be found by examining the Ground Pin Current curves in the Typical Performance Characteristics. Power dissipation will be equal to the sum of the two components listed above. The LT1129 series regulators have internal thermal limiting designed to protect the device during overload conditions. For continuous normal load conditions the maximum junction temperature rating of 125°C must not be exceeded. It is important to give careful consideration to all sources of thermal resistance from junction to ambi- ent. Additional heat sources mounted nearby must also be considered. For surface mount devices heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. Experiments have shown that the heat spreading copper layer does not need to be electri- cally connected to the tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the tab of the device, and a ground or power plane layer either inside or on the opposite side of the board. Although the actual thermal resistance of the PC material is high, the length/area ratio of the thermal resistor between layers is small. Copper board stiffeners and plated through holes can also be used to spread the heat generated by power devices. The following tables list thermal resistances for each package. For the TO-220 package, thermal resistance is given for junction-to-case only since this package is usually mounted to a heat sink. Measured values of thermal resistance for several different board sizes and copper areas are listed for each package. All measure- ments were taken in still air on 3/32" FR-4 board with 1-oz IN LT1129 GND SHDN 112935 F02 ADJ OUT R2 R1 VOUT = 3.75V 1 + + IADJ • R2 VADJ = 3.75V IADJ = 150nA at 25°C OUTPUT RANGE = 3.75V to 30V R2 R1 () () VOUT + Figure 2. Adjustable Operation Adjustable Operation The adjustable version of the LT1129 has an output voltage range of 3.75V to 30V. The output voltage is set by the ratio of two external resistors as shown in Figure 2. The device servos the output voltage to maintain the voltage at the adjust pin at 3.75V. The current in R1 is then equal to 3.75V/R1. The current in R2 is equal to the sum of the current in R1 and the adjust pin bias current. The adjust pin bias current, 150nA at 25°C, flows through R2 into the adjust pin. The output voltage can be calculated according to the formula in Figure 2. The value of R1 should be less than 400k to minimize errors in the output voltage caused by the adjust pin bias current. Note that in shutdown the output is turned off and the divider current will be zero. Curves of Adjust Pin Voltage vs Temperature and Adjust Pin Bias Current vs Temperature appear in the Typical Performance Characteristics. The reference voltage at the adjust pin has a positive temperature coefficient of approximately 15ppm/°C. The adjust pin bias current has a negative temperature coefficient. These effects are small and will tend to cancel each other. The adjustable device is specified with the adjust pin tied to the output pin. This sets the output voltage to 3.75V. Specifications for output voltages greater than 3.75V will be proportional to the ratio of the desired output voltage to 3.75V (VOUT/3.75V). For example: load regulation for an output current change of 1mA to 700mA is – 6mV typical at VOUT = 3.75V. At VOUT = 12V, load regulation would be: 12V 3.75V • –6mV ()= –19mV () |
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