TPS40050

TPS40051

TPS40053

SLUS540F − DECEMBER 2002 − REVISED JUNE 2004

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2

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

TA

APPLICATION

PACKAGE

PART NUMBER

SOURCE(2)

Plastic HTSSOP (PWP)(1)

TPS40050PWP

−40

°C to 85°C

SOURCE/SINK(2)

Plastic HTSSOP (PWP)(1)

TPS40051PWP

−40 C to 85 C

SOURCE/SINK(2) with prebias

Plastic HTSSOP (PWP)(1)

TPS40053PWP

(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS40050PWPR). See the application section of

the data sheet for PowerPAD drawing and layout information.

(2) See Application Information section, pg. 7

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(3)

TPS40050

TPS40051

TPS40053

UNIT

VIN

45

VFB, SS, SYNC

−0.3 to 6

Input voltage range, VIN

SW

−0.3 to 45

V

Input voltage range, VIN

SW, transient < 50 ns

−2.5

V

KFF, with IIN(max) = −5 mA

−0.3 to 11

Output voltage range, VOUT

COMP, RT, SS

−0.3 to 6

Input current, IIN

KFF

5

mA

Output current, IOUT

RT

200

µA

Operating junction temperature range, TJ

−40 to 125

Storage temperature, Tstg

−55 to 150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

C

(3) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Input voltage, VI

8

40

V

Operating free-air temperature, TA

−40

85

°C

THERMAL

PAD

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

KFF

RT

BP5

SYNC

SGND

SS/SD

VFB

COMP

ILIM

VIN

BOOST

HDRV

SW

BP10

LDRV

PGND

PWP PACKAGE(4)(5)

(TOP VIEW)

(4) For more information on the PWP package, refer to TI Technical Brief, Literature No. SLMA002.

(5) PowerPADt heat slug must be connected to SGND (pin 5) or electrically isolated from all other pins.