bq27441-G1

SLUSBH1A – NOVEMBER 2013 – REVISED JANUARY 2014

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

DEVICE INFORMATION

AVAILABLE OPTIONS

BATTERY

FIRMWARE

PART NUMBER

TYPE

bq27441DRZR-G1A

0x0128

0x48

12-pin,

(4.2 V max charge)

bq27441DRZT-G1A

1.09

2.5 × 4 mm

(0x0109)

bq27441DRZR-G1B

SON

0x0312

0x58

(4.3 - 4.35 V max charge)

bq27441DRZT-G1B

(1)

See the CHEM_ID subcommand to confirm the battery chemistry type.

(2)

See the DM_CODE subcommand to confirm the Data Memory code.

(3)

See the FW_VERSION subcommand to confirm the firmware version.

(4)

For the most current package and ordering information see the Package Option Addendum at the end of this document; or, see the TI

website at www.ti.com.

THERMAL INFORMATION

bq27441-G1

UNITS

DRZ (12-PINS)

Junction-to-ambient thermal resistance

64.1

Junction-to-case (top) thermal resistance

59.8

Junction-to-board thermal resistance

52.7

°C/W

Junction-to-top characterization parameter

0.3

Junction-to-board characterization parameter

28.3

Junction-to-case (bottom) thermal resistance

2.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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