®

OPA121

3

ELECTRICAL (FULL TEMPERATURE RANGE SPECIFICATIONS)

OPA121KM

OPA121KP, KU

PARAMETER

CONDITIONS

MIN

TYP

MAX

MIN

TYP

MAX

UNITS

TEMPERATURE RANGE

Specification Range

Ambient Temperature

0

+70

0

+70

°C

INPUT

Input Offset Voltage

±1

±3

±1

±5mV

Average Drift

±3

±10

±3

±10

µV/°C

Supply Rejection

82

94

82

94

dB

±20

±80

±20

±80

µV/V

Input Bias Current

±23

±115

±23

±250

pA

Device Operating

Input Offset Current

±16

±100

±16

±200

pA

Device Operating

VOLTAGE RANGE

Common-Mode Input Range

±10

±11

±10

±11

V

Common-Mode Rejection

82

98

80

96

dB

OPEN-LOOP GAIN, DC

Open-Loop Voltage Gain

106

116

100

110

dB

RATED OUTPUT

Voltage Output

±11

±10.5

±11

V

Current Output

±5.25

±10

±5.25

±10

mA

Short Circuit Current

10

40

10

40

mA

POWER SUPPLY

Current, Quiescent

2.5

4.5

2.5

5

mA

NOTE: (1) Offset voltage, offset current, and bias current are measured with the units fully warmed up.

PACKAGE INFORMATION

PACKAGE DRAWING

MODEL

PACKAGE

OPA121KM

TO-99

001

OPA121KP

8-Pin Plastic DIP

006

OPA121KU

8-Pin SOIC

182

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix D of Burr-Brown IC Data Book.

CONNECTION DIAGRAMS

Top View

M-Package TO-99 (Hermetic)

Top View

P-Package Plastic Mini-DIP

U-Package Plastic SOIC

8

1

2

7

6

5

3

4

Offset

Trim

Offset

Trim

Output

+V

CC

Substrate and Case

–In

+In

OPA121

–V

CC

OPA121

1

2

3

4

5

6

7

8

Offset Trim

+V

CC

–In

+In

–V

CC

Output

Offset Trim

Substrate

TEMPERATURE

MODEL

PACKAGE

RANGE

OPA121KM

TO-99

0

°C to +70°C

OPA121KP

8-Pin Plastic DIP

0

°C to +70°C

OPA121KU

8-Pin SOIC

0

°C to +70°C

ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS

Supply ...........................................................................................

±18VDC

Differential Input Voltage ...............................................................

±36VDC

Input Voltage Range .....................................................................

±18VDC

Storage Temperature Range

M package .................................................................... –65

°C to +150°C

P, U packages ............................................................... –55

°C to +125°C

Operating Temperature Range

M package ...................................................................... –40

°C to +85°C

P, U packages ................................................................. –25

°C to +85°C

Lead Temperature

M, P packages (soldering, 10s) ................................................... +300

°C

U package (soldering, 3s) ........................................................... +260

°C

Junction Temperature .................................................................... +175

°C

NOTES: (1) Packages must be derated based on

θ

JA

= 150

°C/W

(P package);

θ

(2) Short circuit may be to power supply common only. Rating applies to

+25

°C ambient. Observe dissipation limit and T