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OPA124U Datasheet(PDF) 3 Page - Burr-Brown (TI) |
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OPA124U Datasheet(HTML) 3 Page - Burr-Brown (TI) |
3 / 8 page ® OPA124 3 CONNECTION DIAGRAMS Top View DIP 1 2 3 4 8 7 6 5 Substrate +V S Output Offset Trim Offset Trim –In +In –V S Top View SOIC 1 2 3 4 8 7 6 5 Substrate +V S Output NC NC –In +In –V S NC = No Connect The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. PACKAGE/ORDERING INFORMATION BIAS OFFSET PACKAGE TEMPERATURE CURRENT DRIFT PRODUCT PACKAGE DRAWING NUMBER(1) RANGE pA, max µV/°C, max OPA124U 8-Lead SOIC 182 –25 °C to +85°C 5 7.5 OPA124P 8-Pin Plastic DIP 006 –25 °C to +85°C 5 7.5 OPA124UA 8-Lead SOIC 182 –25 °C to +85°C2 4 OPA124PA 8-Pin Plastic DIP 006 –25 °C to +85°C2 4 OPA124PB 8-Pin Plastic DIP 006 –25 °C to +85°C1 2 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. ABSOLUTE MAXIMUM RATINGS(1) Supply ........................................................................................... ±18VDC Internal Power Dissipation(2) ......................................................... 750mW Differential Input Voltage(3) .......................................................... ±36VDC Input Voltage Range(3) ................................................................. ±18VDC Storage Temperature Range .......................................... –65 °C to +150°C Operating Temperature Range ....................................... –40 °C to +125°C Lead Temperature (soldering, 10s) ................................................ +300 °C Output Short Circuit Duration(4) ............................................... Continuous Junction Temperature .................................................................... +175 °C NOTES: (1) Stresses above these ratings may cause permanent damage. (2) Packages must be derated based on θ JA = 90°C/W for PDIP and 100°C/W for SOIC. (3) For supply voltages less than ±18VDC, the absolute maximum input voltage is equal to +18V > VIN > –VCC – 6V. See Figure 2. (4) Short circuit may be to power supply common only. Rating applies to +25 °C ambient. Observe dissipation limit and TJ. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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