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OPA541SM Datasheet(PDF) 3 Page - Burr-Brown (TI) |
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OPA541SM Datasheet(HTML) 3 Page - Burr-Brown (TI) |
3 / 8 page 3 ® OPA541 Top View TO–3 Plastic Package CONNECTION DIAGRAMS –In NC +In NC V O Output Drive R CL –V S +V S Current Sense 13579 11 2468 10 Tab at –V S Current Sense –V S +In –In +V S NC NC Output Drive R CL V O 1 2 3 8 5 6 4 7 ORDERING INFORMATION TEMPERATURE CONTINUOUS PRODUCT PACKAGE RANGE CURRENT OPA541AP Power Plastic –25 °C to +85°C 5A at 25 °C OPA541AM TO-3 –25 °C to +85°C 5A at 25 °C OPA541BM TO-3 –25 °C to +85°C 5A at 25 °C OPA541SM TO-3 –55 °C to +125°C 5A at 25 °C ABSOLUTE MAXIMUM RATINGS Supply Voltage, +VS to –VS ............................................................... 80V Output Current ............................................................................. see SOA Power Dissipation, Internal(1) ........................................................... 125W Input Voltage: Differential .................................................................... ±V S Common-mode ............................................................. ±V S Temperature: Pin solder, 10s ........................................................ +300 °C Junction(1) ............................................................... +150 °C Temperature Range: AM, BM SM Storage .................................................................... –65 °C to +150°C Operating (case) ...................................................... –55 °C to +125°C AP Storage ...................................................................... –40 °C to +85°C Operating (case) ........................................................ –25 °C to +85°C NOTE: (1) Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to achieve high MTTF. PACKAGE INFORMATION PACKAGE DRAWING PRODUCT PACKAGE NUMBER(1) OPA541AP Power Plastic 242 OPA541AM TO-3 030 OPA541BM TO-3 030 OPA541SM TO-3 030 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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