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CMPWR130SR Datasheet(PDF) 6 Page - California Micro Devices Corp

Part # CMPWR130SR
Description  300mA SMARTOR Regulator with V Drive
Download  6 Pages
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Manufacturer  CALMIRCO [California Micro Devices Corp]
Direct Link  http://www.calmicro.com
Logo CALMIRCO - California Micro Devices Corp

CMPWR130SR Datasheet(HTML) 6 Page - California Micro Devices Corp

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3/5/2001
215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
6
CMPWR130
CALIFORNIA MICRO DEVICES
© 2001 California Micro Devices Corp. All rights reserved. SmartOR™ is a trademark of California Micro Devices Corp
Typical Thermal Characteristics
The overall junction to ambient thermal resistance (
θ
JA)
for device power dissipation (P
D) consists primarily of two
paths in series. The first path is the junction to the case
(
θ
JC) which is defined by the package style, and the
second path is case to ambient (
θ
CA) thermal resistance
which is dependent on board layout. The final operating
junction temperature for any set of conditions can be
estimated by the following thermal equation:
T
JUNC = TAMB + PD JC ) + PD CA )
= T
AMB + PD JA)
The CMPWR130 uses a standard SOIC package. When
this package is mounted on a double sided printed circuit
board with two square inches of copper allocated for
“heat spreading”, the resulting overall
θ
JA is 85°C/W.
Based on maximum power dissipation of 0.51W
(1.7V x 300mA) with an ambient of 70°C the resulting
junction temperature will be:
T
JUNC = TAMB + PD JA )
= 70°C + 0.51W (85°C/W)
= 70°C + 43°C
= 113°C
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for “heat spreading”.
Measurements showing performance up to junction
temperature of 125°C were performed under light load
conditions (5mA). This allows the ambient temperature to
be representative of the internal junction temperature.
Note: The use of multi-layer board construction with
power planes will further enhance the thermal perfor-
mance of the package. In the event of no copper area
being dedicated for heat spreading, a multi-layer board
construction, using only the minimum size pad layout,
will typically provide the CMPWR130 with an overall
θ
JA
of 100°C/W, which allows up to 0.55W to be safely
dissipated.
Figure 11. Regulator V
OUT vs TAMB (300mA Load)
Figure 12. Select and Deselect Threshold vs T
JUNC
25
35
45
55
65
75
Ambient Temperature (
˚C)
3.24
3.26
3.28
3.30
3.32
3.34
3.9
4.0
4.1
4.2
4.3
4.4
4.5
25
50
75
100
125
Junction Temperature (
°C)
VDESELECT
VSELECT


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