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CMPWR130SR Datasheet(PDF) 6 Page - California Micro Devices Corp |
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CMPWR130SR Datasheet(HTML) 6 Page - California Micro Devices Corp |
6 / 6 page 3/5/2001 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 6 CMPWR130 CALIFORNIA MICRO DEVICES © 2001 California Micro Devices Corp. All rights reserved. SmartOR™ is a trademark of California Micro Devices Corp Typical Thermal Characteristics The overall junction to ambient thermal resistance ( θ JA) for device power dissipation (P D) consists primarily of two paths in series. The first path is the junction to the case ( θ JC) which is defined by the package style, and the second path is case to ambient ( θ CA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: T JUNC = TAMB + PD (θJC ) + PD (θCA ) = T AMB + PD (θJA) The CMPWR130 uses a standard SOIC package. When this package is mounted on a double sided printed circuit board with two square inches of copper allocated for “heat spreading”, the resulting overall θ JA is 85°C/W. Based on maximum power dissipation of 0.51W (1.7V x 300mA) with an ambient of 70°C the resulting junction temperature will be: T JUNC = TAMB + PD (θJA ) = 70°C + 0.51W (85°C/W) = 70°C + 43°C = 113°C Thermal characteristics were measured using a double sided board with two square inches of copper area connected to the GND pins for “heat spreading”. Measurements showing performance up to junction temperature of 125°C were performed under light load conditions (5mA). This allows the ambient temperature to be representative of the internal junction temperature. Note: The use of multi-layer board construction with power planes will further enhance the thermal perfor- mance of the package. In the event of no copper area being dedicated for heat spreading, a multi-layer board construction, using only the minimum size pad layout, will typically provide the CMPWR130 with an overall θ JA of 100°C/W, which allows up to 0.55W to be safely dissipated. Figure 11. Regulator V OUT vs TAMB (300mA Load) Figure 12. Select and Deselect Threshold vs T JUNC 25 35 45 55 65 75 Ambient Temperature ( ˚C) 3.24 3.26 3.28 3.30 3.32 3.34 3.9 4.0 4.1 4.2 4.3 4.4 4.5 25 50 75 100 125 Junction Temperature ( °C) VDESELECT VSELECT |
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