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CMPWR280 Datasheet(PDF) 9 Page - California Micro Devices Corp |
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CMPWR280 Datasheet(HTML) 9 Page - California Micro Devices Corp |
9 / 10 page © 2000 Calirornia Micro Devices Corp. All rights reserved. 3/00 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com CALIFORNIA MICRO DEVICES CMPWR280 9 Thermal dissipation of junction heat consists primarily of two paths in series. The first path is the junction to the case (θ JC) thermal resistance which is defined by the package style, and the second path is the case to ambient (θ CA) thermal resistance, which is dependent on board layout. The overall junction to ambient (θ JA) thermal resistance is equal to: θ JA = θJC + θCA For a given package style and board layout, the operating junction temperature is a function of junction power dissipation P JUNC, and the ambient temperature, resulting in the following thermal equation: T JUNC = TAMB + PJUNC (θJC ) + PJUNC (θCA ) = T AMB + PJUNC (θJA ) The CMPWR280TO is housed in a TO-263 5-lead package, which provides a θ JC of 3°C/W. The ground tab is soldered down to the PCB. When the device is mounted on a double sided printed circuit board with two square inches of copper allocated for heat spreading, the resulting θ JA is 25°C/W. Typical Thermal Characteristics Based on a maximum power dissipation of 2.85W (1.9Vx1.5A) with an ambient of 70°C the resulting junction temperature will be: T JUNC = TAMB + PJUNC (θJA ) = 70°C + 2.85W (25°C/W) = 70°C + 71°C = 141°C All thermal characteristics of the CMPWR280TO were measured using a double sided board with two square inches of copper area connected to the GND pins for heat spreading. Measurements showing performance up to junction temperature of 125°C were performed under light load conditions (5mA). This allows the ambient temperature to be representative of the internal junction temperature. Note: The use of multi-layer board construction with power planes will further enhance the thermal performance of the package. In the event of no copper area being dedicated for heat spreading, a multi-layer board construction will typically provide the CMPWR280TO with an overall θ JA of 25°C/W which allows up to 2.5W to be safely dissipated. Fig 3.1. Output Voltage vs. Temperature. This shows the regulator V OUT performance up to the maximum rated junction temperature. The overall 125°C variation in junction temperature causes an output voltage change of about 25mV. Fig 3.1. Output Voltage vs. Temperature 3.260 3.280 3.300 3.320 3.340 0 25 50 75 100 125 Junction Temperature [° C] 5mA load |
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