ADNS-7630-TR datasheet(10/48 Pages) AVAGO

Part #	ADNS-7630-TR

Description	One-Chip Bluetooth SoC LaserStream Navigation Sensor

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Manufacturer	AVAGO [AVAGO TECHNOLOGIES LIMITED]

Direct Link	http://www.avagotech.com

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Refer to Figure 7 and Table 2 for the recommended solder reﬂow proﬁle for PCB using Pb-free solder paste LF310.

Table 2. Recommended Solder Reﬂow Proﬁle

Description

Speciﬁcation

Max Ramp-Up Rate,

3°C/sec

Max Ramp-Down Rate,

6°C /sec

Preheat temperature minimum, Tsmin

150°C

Preheat temperature maximum, Tsmax

200°C

Preheat Duration(Tsmin to Tsmax), ts

60-120 sec

Liquidus Temperature, TL

220°C

Time Above Reﬂow (TL=220°C), t

30-90 sec

Peak Temperature, Tp

250°C

Time within 5°C of the speciﬁed classiﬁcation temperature (Tc=250°C ), tp

10 sec

Time 25°C to peak temperature

8 mins maximum

Figure 7. Solder Reﬂow Proﬁle for PCB

Critical and Non-critical Areas of QFN Soldering

As ADNS-7630 is a QFN package, it is designed to be a con-

tact-down package. Refer to Figure 7 and 8 on the critical

and non-critical areas for QFN soldering. The critical area

for soldering ADNS-7630 is on the terminal undersides,

while the terminal sides are deemed as non-critical area,

and thus not intended to be wettable. The non-wetting

of the terminal sides are due to exposed copper on the

package side (which is expected and accepted), occurred

after the singulation step, which is a standard process in

QFN assembly. This is inline with the Industry Standard

(for more information, please refer to IPC-A-610D: Accept-

ability of Electronics Assemblies).

Figure 8. Critical and Non-critical areas (Bottom view)

Preheat Area

Time 25°C to Peak

Time (second)

TP

TL

25

Tsmax

Tsmin

Max. Ramp - Up Rate = 3°C/sec

Max Ramp - Down Rate = 6°C/sec

ts

t

tp

Tc -5°C

Terminal Undersides

(Critical area)

Terminal Sides

(Non-critical area)

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ADNS-7630-TR Datasheet(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED

ADNS-7630-TR Datasheet(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED

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