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THS4061CD Datasheet(PDF) 3 Page - National Semiconductor (TI) |
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THS4061CD Datasheet(HTML) 3 Page - National Semiconductor (TI) |
3 / 32 page THS4061, THS4062 180MHz HIGHSPEED AMPLIFIERS SLOS234E − DECEMBER 1998 − REVISED DECEMBER 2003 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC− 33 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, VI ±VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO 150 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage, VIO ±4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum junction temperature, TJ 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free-air temperature, TA: C-suffix 0 °C to 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-suffix −40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M-suffix −55 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg −65 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds, D and DGN package 300 °C . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package 300 °C . . . . . . . . . . . . . . . . . . . . Case temperature for 60 seconds, FK package 260 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C TA = 125°C PACKAGE TA ≤ 25 C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 70 C POWER RATING TA = 85 C POWER RATING TA = 125 C POWER RATING D 740 mW 6 mW/ °C 475 mW 385 mW — DGN‡ 2.14 W 17.1 mW/ °C 1.37 W 1.11 W — JG 1057 mW 8.4 mW/ °C 627 mW 546 mW 210 mW FK 1375 mW 11 mW/ °C 880 mW 715 mW 275 mW ‡ The DGN package incorporates a PowerPAD on the underside of the device. This acts as a heatsink and must be connected to a thermal dissipation plane for proper power dissipation. Failure to do so can result in exceeding the maximum specified junction temperature, which could permanently damage the device. recommended operating conditions MIN NOM MAX UNIT Supply voltage, VCC+ and VCC− Dual supply ±4.5 ±16 V Supply voltage, VCC+ and VCC− Single supply 9 32 V C-suffix 0 70 Operating free-air temperature, TA I-suffix −40 85 °C Operating free-air temperature, TA M-suffix −55 125 C |
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