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M24C08-WBN6P Datasheet(PDF) 5 Page - STMicroelectronics |
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M24C08-WBN6P Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 40 page DocID023924 Rev 3 5/40 M24C08-W M24C08-R M24C08-F List of figures 5 List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. 8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. WLCSP connections (top view, marking side, with balls on the underside) . . . . . . . . . . . . 7 Figure 4. Chip enable inputs connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6. I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 7. Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 8. Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 9. Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 10. Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 11. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 12. Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C bus at maximum frequency fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 13. AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 14. TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 15. SO8N – 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 31 Figure 16. PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 32 Figure 17. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch . . . . . . . . . . . . . . . . . . Dual Flat Package, No lead) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 18. M24C08-FCS5TP/S WLCSP package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 19. Thin M24C08-FCT5TP/S WLCSP package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 |
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