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THS4504DG4 Datasheet(PDF) 2 Page - National Semiconductor (TI) |
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THS4504DG4 Datasheet(HTML) 2 Page - National Semiconductor (TI) |
2 / 45 page ABSOLUTE MAXIMUM RATINGS (1) PACKAGE DISSIPATION RATINGS RECOMMENDED OPERATING CONDITIONS THS4504 THS4505 SLOS363D – AUGUST 2002 – REVISED MAY 2008 ......................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Over operating free-air temperature range, unless otherwise noted. UNIT Supply voltage, VS 16.5 V Input voltage, VI ±VS Output current, IO 150 mA Differential input voltage, VID 4 V Continuous power dissipation See Package Dissipation Ratings table Maximum junction temperature, TJ +150 °C Maximum junction temperature, continuous operation, long-term reliability, TJ (2) +125 °C Storage temperature range, Tstg –65 °C to +150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds +300 °C (1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. POWER RATING(2) PACKAGE θ JC (°C/W) θ JA (°C/W) (1) TA ≤ +25°C TA = +85°C D (8-pin) 38.3 97.5 1.02 W 410 mW DGN (8-pin) 4.7 58.4 1.71 W 685 mW DGK (8-pin) 54.2 260 385 mW 154 mW (1) This data was taken using the JEDEC standard High-K test PCB. (2) Power rating is determined with a junction temperature of +125 °C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below +125 °C for best performance and long term reliability. MIN NOM MAX UNIT Dual supply ±5 ±7.5 Supply voltage V Single supply 4.5 5 15 Operating free-air temperature, TA –40 +85 °C 2 Submit Documentation Feedback Copyright © 2002–2008, Texas Instruments Incorporated Product Folder Link(s): THS4504 THS4505 |
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