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THS770006IRGER Datasheet(PDF) 6 Page - National Semiconductor (TI) |
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THS770006IRGER Datasheet(HTML) 6 Page - National Semiconductor (TI) |
6 / 39 page 100 W 50 W 50 W 100 W V OCM NC PD V IN - V IN+ V OCM NC NC Unused V OUT+ V OUT - Unused NC 1 2 3 4 5 6 18 17 16 15 14 13 THS770006 SBOS520B – JULY 2010 – REVISED JANUARY 2012 www.ti.com PIN CONFIGURATION RGE PACKAGE VQFN-24 (TOP VIEW) PIN DESCRIPTIONS PIN NO. NAME DESCRIPTION 1 NC No internal connection 2 PD Power down. High = low power (sleep) mode. Low = active. 3 VIN– Inverting input pin 4 VIN+ Noninverting input pin 5 VOCM Output common-mode voltage control input pin 6, 7 NC No internal connection 8, 9, 10, 11 GND Ground. Must be connected to thermal pad. 12, 13 NC No internal connection 14 Unused Bonded to die, but not used. Tie to GND. 15 VOUT– Inverting output pin 16 VOUT+ Noninverting output pin 17 Unused Bonded to die, but not used. Tie to GND. 18, 19 NC No internal connection 20, 21, 22, VS+ Power supply pins, +5V nominal 23 24 NC No internal connection Thermal pad Thermal pad on bottom of device is used for heat dissipation and must be tied to GND 6 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): THS770006 |
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