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SN74LVC1G66QDCKRQ1 Datasheet(PDF) 1 Page - Texas Instruments

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Part # SN74LVC1G66QDCKRQ1
Description  SINGLE BILATERAL ANALOG SWITCH
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G66QDCKRQ1 Datasheet(HTML) 1 Page - Texas Instruments

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SN74LVC1G66Q1
SINGLE BILATERAL ANALOG SWITCH
SCES499D − OCTOBER 2003 − REVISED JANUARY 2008
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Qualified for Automotive Applications
D 1.65-V to 5.5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D High On-Off Output Voltage Ratio
D High Degree of Linearity
D High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF)
D Low On-State Resistance, Typically ≈5.5 Ω
(VCC = 4.5 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
description/ordering information
This single analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING§
−40
°C to 125°C
SOT (SOT-23) − DBV
Reel of 3000
1P1G66QDBVRQ1
C66_
−40
°C to 125°C
SOT (SOT-70) − DCK
Reel of 3000
1P1G66QDCKRQ1
C6_
† For the most current package and ordering information, see the Package Option Addendum at the end of this document,
or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
§ The actual top-side marking has one additional character that designates the wafer fab/assembly site.
FUNCTION TABLE
CONTROL
INPUT
(C)
SWITCH
L
OFF
H
ON
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its published specifications.
DBV or DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
A
B
GND
VCC
C
Copyright
 2008, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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