Data Sheet

8

Rev. 1.0, 2013-01-31

High Current PN Half Bridge

BTN8960TA

General Product Characteristics

4.3

Thermal Resistance

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.3.1

Thermal Resistance

Junction-Case, High Side Switch

R

R

thJC(HS)

–

0.6

0.9

K/W

1)

4.3.2

Thermal Resistance

Junction-Case, Low Side Switch

R

R

thJC(LS)

–

1.7

2.4

K/W

1)

1) Not subject to production test, specified by design

4.3.3

Thermal Resistance

Junction-Ambient

R

thJA

–20

–

K/W

1) 2)

2) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.