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57C128FB Datasheet(PDF) 2 Page - List of Unclassifed Manufacturers |
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2 / 13 page STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87661 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87661 01 X A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 27C128 16K x 8-bit UVEPROM 90 ns 02 27C128 16K x 8-bit UVEPROM 120 ns 03 27C128 16K x 8-bit UVEPROM 150 ns 04 27C128 16K x 8-bit UVEPROM 170 ns 05 27C128 16K x 8-bit UVEPROM 200 ns 06 27C128 16K x 8-bit UVEPROM 250 ns 07 27C128 16K x 8-bit UVEPROM 300 ns 08 27C128 16K x 8-bit UVEPROM 70 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style 1/ X GDIP1-T28 or CDIP2-T28 28 dual-in-line package Y CQCC1-N32 32 rectangular leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 2/ Supply voltage range (VCC) 2/ ..................................................... -0.6 V dc to 6.25 V dc Supply voltage range (VPP) 2/ ..................................................... -0.6 V dc to 14.0 V dc All input voltage range except A9 2/ .......................................... -0.6 V dc to 6.25 V dc Input voltage range (A9) 2/ .......................................................... -0.6 V dc to 13.5 V dc Output voltage range 2/ .............................................................. -0.6 V dc to VCC + 1.0 V dc Storage temperature range ........................................................ -65 C to +150C Power dissipation ........................................................................ 300 mW Lead temperature (soldering, 10 seconds) .................................. +300 C Thermal resistance, junction-to-case ( θ JC) ................................... See MIL-STD-1835 Junction temperature (TJ) .......................................................... +150 C 3/ Data retention ............................................................................ 10 years minimum 1.4 Recommended operating conditions. Supply voltage range (VCC) 4/ .................................................... 4.5 V dc to 5.5 V dc Supply voltage range (VPP) 5/ ..................................................... 4.5 V dc to 5.5 V dc High level input voltage range (VIH).............................................. 2.0 V dc to 6.5 V dc (TTL) High level input voltage range (VIH).............................................. VCC -0.2 V dc to VCC +0.2 V dc (CMOS) Low level input voltage range (VIL) ............................................. -0.1 V dc to 0.8 V dc (TTL) Low level input voltage range (VIL) ............................................. GND -0.2 to GND +0.2 V dc (CMOS) Case operating temperature range (TC) ...................................... -55 C to +125C 1/ Lid shall be transparent to permit ultraviolet light erasure. 2/ Under absolute maximum ratings, voltages are with respect to GND. 3/ Maximum junction temperature may be increased to +175 C during burn-in and steady-state life. 4/ VCC must be applied before or at the same time as VPP and removed after or at the same time as VPP. The device must not be inserted into or removed from the board when VPP or VCC is applied. 5/ VPP can be connected to VCC directly (except in the program mode). VCC supply current in this case would be ICC + IPP. During programming, VPP must be maintained at 12.5 V (±0.5 V). |
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