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LM324QD Datasheet(HTML) 8 Page - Cystech Electonics Corp. |
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LM324QD Datasheet(HTML) 8 Page - Cystech Electonics Corp. |
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CYStech Electronics Corp. Spec. No. : C564QD Issued Date : 2012.12.11 Revised Date : Page No. : 8/10 LM324QD CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5 °C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6 °C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. |
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