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SAP5SD-A-G1-R Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers |
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9 / 63 page SAP5S / SAP51 Universal Actuator-Sensor Interface IC Data Sheet July 17, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 3.1 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to changes without notice. 9 of 62 1 General Device Specification 1.1. Absolute Maximum Ratings (Non Operating) Table 1: Absolute Maximum Ratings Symbol Parameter Min Max Unit Note VLTGN Voltage reference 0 0 V VLTGP-LTGN Voltage difference between LTGP and LTGN (VLTGP - VLTGN) 0 40 V 1 VLTGP-LTGN_P Pulse voltage between LTGP and LTGN (VLTGP - VLTGN) 0 50 V 2 Vinputs1 Voltage at pin CDC, D0…D3, P0…P3, DSTBn, PSTBnBn, LED1, LED2, PFAULT, UOUT -0.3 V UOUT+ 0.3 V Vinputs2 Voltage at pins OSC1, OSC2, U5R -0.3 7 V Iin Input current into any pin except supply pins -50 50 mA 4 H Humidity non-condensing 5 VHBM Electrostatic discharge – Human Body Model (HBM2) 1500 V 6 VEDM Electrostatic discharge – Equipment Discharge Model (EDM) 200 V 7 STG Storage temperature -55 125 °C lead Soldering temperature Sn/Pb JEDEC-J-STD-020D 240 °C lead Soldering temperature 100%Sn JEDEC-J-STD-020D 260 °C Rthj-16 Thermal resistance of SOIC 16 package 80 100 K/W 8 Rthj-20 Thermal resistance of SOIC 20 package 75 95 K/W 8 1 reverse polarity protection has to be performed externally, 2 pulse with 50µs, repetition rate 0.5 Hz 3 VLTGP-LTGN and VLTGP-LTGN_P must not be violated 4 Latch-up resistance, reference pin is 0V 5 Level 4 according to JEDEC-020D is guaranteed 6 HBM: C = 100pF charged to VHBM2 with resistor R = 1.5k in series, valid for all pins except LTGP-LTGN 7 EDM: C = 200pF charged to VEDM with no resistor in series, valid for LTGP-LTGN only 8 Single layer board, Ptot = 0.5W; air velocity = 0m/s max. value; air velocity = 2.5m/s min. value |
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