ISL6208, ISL6208B

2

FN9115.6

January 31, 2012

Pin Configurations

Block Diagram

ti

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

(Pb-free)

PKG.

DWG. #

ISL6208CBZ

ISL62 08CBZ

-10 to +100

8 Ld SOIC

M8.15

ISL6208CRZ

208Z

-10 to +100

8 Ld 3x3 QFN

L8.3x3

ISL6208BCRZ

8BC

-10 to +100

8 Ld 2x2 DFN

L8.2x2D

ISL6208IBZ

ISL62 08IBZ

-40 to +100

8 Ld SOIC

M8.15

ISL6208IRZ

8IRZ

-40 to +100

8 Ld 3x3 QFN

L8.3x3

ISL6208BIRZ

8BI

-40 to +100

8 Ld 2x2 DFN

L8.2x2D

NOTES:

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin

plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free

products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

ISL6208CBZ, ISL6208IBZ

(8 LD SOIC)

TOP VIEW

ISL6208CRZ, ISL6208IRZ

(8 LD 3x3 QFN)

TOP VIEW

ISL6208BCRZ, ISL6208BIRZ

(8 LD 2x2 DFN)

TOP VIEW

UGATE

BOOT

PWM

GND

1

2

3

4

8

7

6

5

PHASE

FCCM

VCC

LGATE

7

8

4

3

1

2

6 FCCM

VCC

BOOT

PWM

5

6

1

6 VCC

LGATE

PWM

GND

5

6

6 PHASE

FCCM

7

8

UGATE

BOOT 2

3

4

VCC

PWM

10K

CONTROL

LOGIC

SHOOT-

THROUGH

PROTECTION

BOOT

UGATE

PHASE

LGATE

GND

VCC

FCCM

THERMAL PAD (FOR QFN AND DFN PACKAGE ONLY)

FIGURE 1. BLOCK DIAGRAM