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Transient Voltage Suppression Diodes

Revision: January 09, 2009

©2009 Littelfuse, Inc.

Specifications are subject to change without notice.

Surface Mount – 600W > SMBJ series

SMBJ Series

Please refer to http://www.Littelfuse.com/series/SMBJ.html for current information.

Physical Specifications

Weight

0.003 ounce, 0.093 grams

Case

JEDEC DO214AA. Molded plastic body

over glass passivated junction

Polarity

Color band denotes cathode except

Bidirectional

Terminal

Matte Tin-plated leads, Solderable per

JESD22-B102D

Environmental Specifications

Temperature Cycle

JESD22-A104

Pressure Cooker

JESD 22-A102

High Temp. Storage

JESD22-A103

HTRB

JESD22-A108

Thermal Shock

JESD22-A106

Soldering Parameters

Time (t)

T

s(min)

T

s(max)

T

L

T

P

t

s

Preheat

t

L

t

p

Ramp-up

Critical Zone

T

L

to T

P

Ramp-down

t 25˚C to Peak

25˚C

Reflow Condition

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

Average ramp up rate (LiquidusTemp

(T

3°C/second max

T

3°C/second max

Reflow

-Temperature (T

217°C

-Time (min to max) (t

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

280°C