GP1201FSS18

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Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.

www.dynexsemi.com

ASSOCIATED PUBLICATIONS

Title

Application Note

Number

Electrostatic handling precautions

AN4502

An introduction to IGBTs

AN4503

IGBT ratings and characteristics

AN4504

Heatsink requirements for IGBT modules

AN4505

Calculating the junction temperature of power semiconductors

AN4506

Gate drive considerations to maximise IGBT efficiency

AN4507

Parallel operation of IGBTs – punch through vs non-punch through characteristics

AN4508

Guidance notes for formulating technical enquiries

AN4869

Principle of rating parallel connected IGBT modules

AN5000

Short circuit withstand capability in IGBTs

AN5167

Driving Dynex Semincoductor IGBT modules with Concept gate drivers

AN5384

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic

semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and

current capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The

Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of

our customers.

Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete

Solution (PACs).

HEATSINKS

The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise

the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is

available on request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer

service office.