BLF6G10L-260PRN_LS-260PRN

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© NXP B.V. 2013. All rights reserved.

Product data sheet

Rev. 2 — 12 July 2013

8 of 15

NXP Semiconductors

BLF6G10L(S)-260PRN

Power LDMOS transistor

8.

Test information

8.1 Test circuit

Figure 6 shows the PCB test circuit layout

8.2 Bill of materials (B.O.M.)

The following Bill of materials (Table 10) shows a list of all the components needed to

build the RF test circuit.

The above layout shows the test circuit used to measure the devices in production. The RF Power and Base-Stations group can

provide a more appropriate application demonstration for specific customer needs.

Fig 6.

Input and output test circuit PCBs’

NXP BLF6G10L-260PRN

Output Rev 01

NXP

BLF6G10L-260PRN

Input Rev 01

+

−

+

−

C10

C13

C9

C1

C5

C4

R3

R6

C7

C11

C12

C14

014aab129

Table 10.

Bill of materials

Component

Description

Type

Value

Code number

Remarks

base plate

see mechanical

drawing.

input PCB

see PCB info.

output PCB

see PCB info.

15

 bolt M2

brass (nickel plated)

15

 washer M2

brass (nickel plated)

4

 contact block

12

 4 mm

brass (milled)

rubber O-ring

Viton

17

 1 mm

conductive elastomer

(“silver” rubber)

Chomerics

35

 1 mm

(2x)

CHO-SEAL 1273