 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
IRU3037CSTR Datasheet(PDF) 10 Page - International Rectifier |
|
||||||||||||||||||||||||||||||
IRU3037CSTR Datasheet(HTML) 10 Page - International Rectifier |
|
|
10 / 21 page  10 IRU3037/IRU3037A & (PbF) www.irf.com 6) Place second pole at the ESR zero. FP2 = FESR Check if R8 > If R8 is too small, increase R7 and start from step 2. 7) Place second zero around the resonant frequency. FZ2 = FLC 8) Use equation (1) to calculate R5. These design rules will give a crossover frequency ap- proximately one-tenth of the switching frequency. The higher the band width, the potentially faster the load tran- sient speed. The gain margin will be large enough to provide high DC-regulation accuracy (typically -5dB to - 12dB). The phase margin should be greater than 45 ) for overall stability. IC Quiescent Power Dissipation Power dissipation for IC controller is a function of ap- plied voltage, gate driver loads and switching frequency. The IC's maximum power dissipation occurs when the IC operating with single 12V supply voltage (Vcc=12V and Vc ≅24V) at 400KHz switching frequency and maxi- mum gate loads. Figures 9 and 10 show voltage vs. current, when the gate drivers loaded with 470pF, 1150pF and 1540pF ca- pacitors. The IC's power dissipation results to an exces- sive temperature rise. This should be considered when using IRU3037A for such application. Layout Consideration The layout is very important when designing high fre- quency switching converters. Layout will affect noise pickup and can cause a good design to perform with less than expected results. Start to place the power components, make all the con- nection in the top layer with wide, copper filled areas. The inductor, output capacitor and the MOSFET should be close to each other as possible. This helps to reduce the EMI radiated by the power traces due to the high switching currents through them. Place input capacitor directly to the drain of the high-side MOSFET, to reduce the ESR replace the single input capacitor with two par- allel units. The feedback part of the system should be kept away from the inductor and other noise sources, and be placed close to the IC. In multilayer PCB use one layer as power ground plane and have a control cir- cuit ground (analog ground), to which all signals are ref- erenced. The goal is to localize the high current path to a separate loop that does not interfere with the more sensitive analog control function. These two grounds must be connected together on the PC board layout at a single point. Figure 8 shows a suggested layout for the critical com- ponents, based on the schematic on page 14. Figure 8 - Suggested layout. (Topside shown only) 1 gm R8 = 1 2 π × C10 × FP2 R6 = - R8 1 2 π × C10 × FZ2 R5 = × R6 VREF VOUT - VREF C 5 D 1 D 2 IRU3037 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 L1 L2 U1 Q1 R4 C4 C9 C8 C3 R5 R6 C1 Vin C2A, B C7A, B Analog Gnd PGnd PGnd Vout PGnd D 3 Single Point Analog Gnd Connect to Power Ground plane Analog Gnd PGnd |
Similar Part No. - IRU3037CSTR |
|
Similar Description - IRU3037CSTR |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.NET |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
