EL5221CW-T13 datasheet(11/13 Pages) ELANTEC

Part #	EL5221CW-T13

Description	Dual 12MHz Rail-to-Rail Input-Output Buffer

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Manufacturer	ELANTEC [Elantec Semiconductor]

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11

EL5221C

Dual 12MHz Rail-to-Rail Input-Output Buffer

determine if load conditions need to be modified for the

buffer to remain in the safe operating area.

The maximum power dissipation allowed in a package is

determined according to:

where:

TJMAX = Maximum Junction Temperature

TAMAX= Maximum Ambient Temperature

ΘJA = Thermal Resistance of the Package

PDMAX = Maximum Power Dissipation in the

Package

The maximum power dissipation actually produced by

an IC is the total quiescent supply current times the total

power supply voltage, plus the power in the IC due to the

loads, or:

when sourcing, and

when sinking.

where:

i = 1 to 2 for Dual Buffer

VS = Total Supply Voltage

ISMAX = Maximum Supply Current Per Channel

VOUTi = Maximum Output Voltage of the

Application

ILOADi = Load Current

If we set the two PDMAX equations equal to each other,

we can solve for RLOADi to avoid device overheat. Fig-

ure 3 and Figure 4 provide a convenient way to see if the

device will overheat. The maximum safe power dissipa-

tion can be found graphically, based on the package type

and the ambient temperature. By using the previous

equation, it is a simple matter to see if PDMAX exceeds

the device’s power derating curves. To ensure proper

operation, it is important to observe the recommended

derating curves shown in Figure 3 and Figure 4.

Figure 3. Package Power Dissipation vs

Ambient Temperature

Figure 4. Package Power Dissipation vs

Ambient Temperature

Unused Buffers

It is recommended that any unused buffer have the input

tied to the ground plane.

P

DMAX

T

JM AX

T

AMAX

–

Θ

JA

---------------------------------------------

=

P

DMAX

ΣiV

[

S

I

SMA X

V

S +

(

V

OU T i )

I

LOAD i ]

×

–

+

×

=

P

DMAX

ΣiV

[

S

I

SM AX

V

(

OU T iVS- )

I

LOAD i

×

–

+

×]

=

Package Mounted on a JEDEC JESD51-7 High

Effective Thermal Conductivity Test Board

Ambient Temperature (°C)

0.6

0

1

0.8

0.4

0.2

50

150

100

0125

25

75 85

435mW

MAX TJ=125°C

SOT

23-6

230°

C/W

870mW

M

SO

P-8

11

5°C

/W

Ambient Temperature (°C)

Package Mounted on a JEDEC JESD51-3 Low

Effective Thermal Conductivity Test Board

0.2

0

0.6

0.5

0.1

50

150

100

0125

25

75 85

0.4

0.3

SO

T23

-6

256

°C/W

391mW

MAX TJ=125°C

486mW

MS

OP

-8

206

°C

/W

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EL5221CW-T13 Datasheet(PDF) 11 Page - Elantec Semiconductor

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