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NCP380HMU10AGEVB Datasheet(PDF) 3 Page - ON Semiconductor

Part # NCP380HMU10AGEVB
Description  Fixed/Adjustable Current??Limiting Power?륞istribution Switches
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP380HMU10AGEVB Datasheet(HTML) 3 Page - ON Semiconductor

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NCP380, NCV380
http://onsemi.com
3
Table 2. MAXIMUM RATINGS
Rating
Symbol
Value
Unit
From IN to OUT Pins: Input/Output (Note 1)
VIN , VOUT
−7.0 to +7.0
V
IN, OUT, EN, ILIM, FLAG, Pins: Input/Output (Note 1)
VEN, VILIM, VFLAG, VIN, VOUT
−0.3 to +7.0
V
FLAG Sink Current
ISINK
1
mA
ILIM Source Current
ILIM
1
mA
ESD Withstand Voltage (IEC 61000−4−2)
(Output Only, when Bypassed with 1.0 mF Capacitor Minimum)
ESD IEC
15 Air, 8 Contact
kV
Human Body Model (HBM) ESD Rating (Note 2)
ESD HBM
2,000
V
Machine Model (MM) ESD Rating (Notes 2 and 3)
ESD MM
200
V
Latch-up Protection (Note 4)
Pins IN, OUT, EN, ILIM, FLAG
LU
100
mA
Maximum Junction Temperature Range (Note 6)
TJ
−40 to +TSD
C
Storage Temperature Range
TSTG
−40 to +150
C
Moisture Sensitivity (Note 5)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) 200 V per JEDEC standard: JESD22−A115 for all pins.
3. Except EN pin, 150 V.
4. Latch up Current Maximum Rating: 100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
Table 3. OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIN
Operational Power Supply
2.5
5.5
V
VEN
Enable Voltage
0
5.5
TA
Ambient Temperature Range
−40
25
+85
C
TJ
Junction Temperature Range
−40
25
+125
C
RILIM
Resistor from ILIM to GND Pin
5.0
250
kW
ISINK
FLAG Sink Current
1.0
mA
CIN
Decoupling Input Capacitor
1.0
mF
COUT
Decoupling Output Capacitor
USB Port per Hub
120
mF
RqJA
Thermal Resistance Junction-to-Air
UDFN−6 Package (Notes 7 and 8)
120
C/W
TSOP−5 Package (Notes 7 and 8)
305
C/W
TSOP−6 Package (Notes 7 and 8)
280
C/W
IOUT
Maximum DC Current
UDFN−6 Package
2.1
A
TSOP−5, TSOP−6 Package
1.0
A
PD
Power Dissipation Rating (Note 9)
TA v 25C
UDFN−6 Package
830
mW
TSOP−5 Package
325
mW
TSOP−6 Package
350
mW
TA = 85C
UDFN−6 Package
325
mW
TSOP−5 Package
130
mW
TSOP−6 Package
145
mW
7. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
8. The RqJA is dependent of the PCB heat dissipation. Board used to drive this data was a 2”  2” NCP380EVB board. It is a 2 layers board
with 2-once copper traces on top and bottom of the board. Exposed pad is connected to ground plane for UDFN−6 version only.
9. The maximum power dissipation (PD) is given by the following formula:
PD +
TJMAX * TA
RqJA


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