AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

4 of 18

www.diodes.com

March 2013

© Diodes Incorporated

AP2501/AP2511

Symbol

Parameter

Conditions (Note 7)

Min

Typ

Max

Unit

Input UVLO

1.6

2.0

2.4

V

Input UVLO Hysteresis

50

mV

Input Shutdown Current

Disabled, OUT = open

0.1

1.0

µA

Input Quiescent Current

Enabled, OUT = open

60

100

µA

Input Leakage Current

Disabled, OUT grounded

0.1

1.0

µA

Reverse Leakage Current

0.01

1.00

µA

Switch on-resistance

70

78

mΩ

105

90

108

135

Over-Load Current Limit (Note 7)

2.8

3.7

4.6

A

Current limiting trigger threshold

Output Current Slew rate (<100A/s)

3.7

A

Short-Circuit Current Limit

Enabled into short circuit

3.7

A

Short-Circuit Response Time

2

µs

EN Input Logic Low Voltage

0.8

V

EN Input Logic High Voltage

2

V

EN Input leakage

0.01

1.00

µA

Output leakage current

0.5

1

µA

Output turn-on delay time

0.1

ms

Output turn-on rise time

0.6

1.5

ms

Output turn-off delay time

0.1

ms

Output turn-off fall time

0.05

0.10

ms

FLG output FET on-resistance

20

40

Ω

FLG Off Current

0.01

1.00

µA

FLG Blanking Time

Assertion or deassertion due to overcurrent and

over-temperature condition

4

7

15

ms

Discharge time

0.6

ms

Discharge resistance (Note 8)

100

Ω

Thermal Shutdown Threshold

Enabled

140

C

Thermal Shutdown Hysteresis

20

C

Thermal Resistance Junction-to-

Ambient

SO-8 (Note 9)

96

C/W

MSOP-8 (Note 9)

130

C/W

MSOP-8EP (Note 10)

92

C/W

U-DFN3030-8 (Note 10)

84

C/W

U-DFN2020-6 (Note 11)

90

C/W

Notes:

7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.

discharge function offers a resistive discharge path for the external storage capacitor for limited time.

9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.

10. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground

plane.

11. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground