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FMA501 Datasheet(PDF) 3 Page - Filtronic Compound Semiconductors |
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FMA501 Datasheet(HTML) 3 Page - Filtronic Compound Semiconductors |
3 / 4 page Preliminary Data Sheet FMA501 OC-192 MODULATOR DRIVER AMPLIFIER Phone: (408) 988-1845 http:// www.filss.com Revised: 3/22/02 Fax: (408) 970-9950 Email: sales@filss.com • ASSEMBLY DIAGRAM Notes: • Apply VGG first, then VGC and VDD. • Disconnect VGC first, then VDD and VGG when turning off. • Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended. • The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes. • Bond on bond or stitch bonds acceptable. • Conductor over conductor acceptable. Conductors must not short. Gate bias: VGG = -3.0 V Gain control: VGC = 1.5 V Inductor for drain = 300uH Chip capacitor: 100nF GND VDD=7~8V |
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