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IC51-0482-1009-2 Datasheet(PDF) 2 Page - List of Unclassifed Manufacturers |
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IC51-0482-1009-2 Datasheet(HTML) 2 Page - List of Unclassifed Manufacturers |
2 / 7 page SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER SMT Devices 41 Test Solutions Series Overview *SOP (Small Outline Packages, Gullwing Leads) Specifications Insulation Resistance: 1,000M Ω min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m Ω max. at 10mA/20mV max. Current Rating: 1A max. Operating Temperature Range: –40°C to +170°C –40°C to +150°C (type -004*) Mating Cycles: 10,000 insertions min. Contact Force: 20g to 80g per pin Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel 0.5mm Pitch Series IC191 (Open Top) Thin Small Outline Package (TSOP Type I) Part Number (Details) Series No. Number of Sides with Contacts No. of Contact Pins Design Number Positioning Pin: N=Without Positioning Pin Unmarked =With Positioning Pin IC191 032 001 2* -- cont‘d next page Series IC51 Contact Styles Series IC (kelvin) Series IC189 / IC191 Series IC235 Series IC (two point Contact) |
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